Gold Electroplating

Gold electroplating deposits a thin, corrosion-proof, highly conductive gold layer on selected surfaces for reliable electrical contact and premium appearance.

Overview

Gold electroplating applies a controlled, very thin layer of gold onto a conductive substrate using an electrolytic bath. It delivers extremely low contact resistance, excellent corrosion resistance, and stable performance over long lifetimes, especially in harsh or high-reliability environments. Thickness typically ranges from flash (≤0.1 µm) to several microns for wear and contact durability.

Use gold electroplating when you need consistent electrical performance, solderability, and long-term corrosion protection on connectors, contacts, RF components, or precision hardware. It supports both selective and full-coverage plating and works well for high-mix, low-volume through very high-volume production. Tradeoffs include higher material cost, sensitivity to base metal preparation, and the need for careful specification of thickness, underplates (often nickel), and masking. Poorly defined specs can drive up cost or produce unreliable contact performance, so clear drawings and functional requirements are critical.

Common Materials

  • Copper
  • Brass
  • Phosphor bronze
  • Nickel
  • Kovar
  • Stainless steel 304

Tolerances

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Applications

  • PCB edge connectors and fingers
  • Spring contacts and pogo pins
  • RF and microwave connectors
  • Semiconductor test sockets and probe pins
  • High-reliability relay and switch contacts
  • Luxury hardware and watch components

When to Choose Gold Electroplating

Choose gold electroplating when you need low, stable contact resistance, long-term corrosion resistance, and reliable signal performance on conductive parts. It fits small to medium feature sizes, selective areas, and both prototype and production volumes where surface performance justifies gold’s material cost.

vs Anodizing

Use gold electroplating when you need a conductive, noble metal surface for electrical contacts or RF paths rather than an insulating oxide layer. Gold plating is better for fine connector features, solderable pads, and components where any increase in electrical resistance is unacceptable.

vs Powder Coating

Choose gold electroplating instead of powder coating when you need a thin, precise, electrically conductive finish rather than a thick, protective, non-conductive layer. Gold plating suits small, detailed metal parts and contact areas where film buildup and edge rounding from powder would interfere with fit or function.

vs E-Coating

Select gold electroplating when your priority is low contact resistance, solderability, or high-frequency performance, not bulk corrosion protection of large structures. Gold plating targets critical contact zones and precision interfaces, whereas e-coating is geared toward uniform, insulating protection on larger assemblies and chassis.

vs Nickel Electroplating

Use gold electroplating over nickel when you need a noble, non-tarnishing surface for reliable electrical contacts or premium appearance. Often the best stack is nickel for hardness and barrier properties with a gold top layer where the gold controls contact behavior and corrosion resistance.

vs Physical Vapor Deposition (PVD)

Prefer gold electroplating over PVD when you need thicker, more ductile gold layers on complex geometries and internal features, such as connectors and springs. Electroplating is generally more cost-effective for high-volume electrical contacts and allows selective plating with masking or tooling to control where the gold is applied.

Design Considerations

  • Specify gold thickness by function: flash (≤0.1 µm) for cosmetics, 0.5–1.3 µm for light contacts, 2–5 µm for high-cycle wear surfaces
  • Call out underplates (often nickel) explicitly to control diffusion, solderability, and hardness, especially on copper alloys and high-temperature applications
  • Define selective plating areas clearly with datums, dimensions, and view details so shops can design masks and tooling accurately
  • Avoid sharp inside corners, deep blind holes, and extremely narrow slots where solution flow and coverage will be poor or inconsistent
  • Specify surface finish and cleanliness requirements for the base metal; plating will not hide machining marks, pits, or contamination
  • State electrical performance requirements (contact resistance, mating cycles, environment) so the plater can recommend hardness, thickness, and bath chemistry